Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
TF

Tzu-Jui Fang

TSMC: 1 patents #2,025 of 3,957Top 55%
📍 Dongbeitou, CN: #1 of 4 inventorsTop 25%
Overall (2025): #184,618 of 469,880Top 40%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12198996 Integrated fan-out package, package-on-package structure, and manufacturing method thereof Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Po-Yao Chuang 2025-01-14