Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388047 | Integrated fan-out platform and manufacturing method for semiconductor devices | Li-Hsien Huang, Hsueh-Lung Cheng, Yao-Chun Chuang | 2025-08-12 |
| 12382587 | Methods and systems for improving surface mount joinder | Hsien-Wen Liu, Shih-Ting Hung, Jyun-Lin Wu, Yao-Chun Chuang | 2025-08-05 |
| 12349268 | Package component | Chun-Wei Chang, Jian-Hong Lin, Shu-Yuan Ku, Wei-Cheng Liu, Jun He | 2025-07-01 |
| 12313675 | Method and device for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2025-05-27 |
| 12293959 | Through-circuit Vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Hong Hsieh, Ming-Yih Wang | 2025-05-06 |
| 12270852 | Method and system for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2025-04-08 |
| 12243805 | Through-circuit vias in interconnect structures | Jian-Hong Lin, Hsin Chang, Ming-Hong Hsieh, Ming-Yih Wang | 2025-03-04 |