Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293959 | Through-circuit Vias in interconnect structures | Jian-Hong Lin, Ming-Hong Hsieh, Ming-Yih Wang, Yinlung Lu | 2025-05-06 |
| 12243805 | Through-circuit vias in interconnect structures | Jian-Hong Lin, Ming-Hong Hsieh, Ming-Yih Wang, Yinlung Lu | 2025-03-04 |