Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
JL

Jian-Hong Lin

BO BOE: 5 patents #415 of 3,061Top 15%
BC Beijing Boe Optoelectronics Technology Co.: 4 patents #40 of 251Top 20%
TSMC: 4 patents #764 of 3,957Top 20%
BC Beijing Boe Display Technology Co.: 1 patents #151 of 333Top 50%
📍 Songyuan, TW: #1 of 7 inventorsTop 15%
Overall (2025): #7,604 of 469,880Top 2%
9
Patents 2025

Issued Patents 2025

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
12349268 Package component Chun-Wei Chang, Shu-Yuan Ku, Wei-Cheng Liu, Yinlung Lu, Jun He 2025-07-01
12339549 Array substrate and touch display device Yuqiong Chen, Yong Zhang, Jian Wang, Xianglei Qin, Limin Zhang +9 more 2025-06-24
12340844 Phase-change memory cell and method for fabricating the same Yung-Huei Lee, Chun-Wei Chang, Wen-Hsien Kuo, Pei-Chun Liao, Chih-Hung Nien 2025-06-24
12326639 Display panel and driving method thereof, and display device Xianglei Qin, Yong Zhang, Zhichao Yang, Limin Zhang, Zepeng Sun +9 more 2025-06-10
12324293 Light emitting substrate, wiring substrate and display device Zhichao Yang, Jian Wang, Yong Zhang, Yingzi WANG, Feng QU +8 more 2025-06-03
12293959 Through-circuit Vias in interconnect structures Hsin Chang, Ming-Hong Hsieh, Ming-Yih Wang, Yinlung Lu 2025-05-06
12253754 Display substrate, display panel, and display device Yong Zhang, Jian Wang, Wei Zhao, Gang Hua, Limin Zhang +15 more 2025-03-18
12256581 Light-emitting substrate, backlight source and display device Zhichao Yang, Jian Wang, Yong Zhang, Xianglei Qin, Limin Zhang +6 more 2025-03-18
12243805 Through-circuit vias in interconnect structures Hsin Chang, Ming-Hong Hsieh, Ming-Yih Wang, Yinlung Lu 2025-03-04