Issued Patents 2025
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424558 | Bridge die having different surface orientation than IC dies interconnected by the bridge die | Chin-Fu Kao, Tsung-Yang Hsieh, Jyun-Lin Wu, Yao-Chun Chuang | 2025-09-23 |
| 12406936 | Semiconductor package with substrate recess and methods for forming the same | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-09-02 |
| 12406897 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-09-02 |
| 12406898 | Chip package structure with lid | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-09-02 |
| 12387992 | Package and method for forming the same | Chien-Tung Yu, Chia-Hsiang Lin, Chin-Hua Wang, Shin-Puu Jeng | 2025-08-12 |
| 12387991 | Manufacturing method of semiconductor package | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-08-12 |
| 12374561 | Chip package structure with ring dam | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2025-07-29 |
| 12362197 | Semiconductor die package with ring structure | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-07-15 |
| 12362307 | Semiconductor package with ball grid array connection having improved reliability | Chen-Nan Chiu, Jyun-Lin Wu, Yao-Chun Chuang | 2025-07-15 |
| 12362258 | Thermal module for a semiconductor package and methods of forming the same | Po-Yao Lin, Sheng-Liang Kuo, Kathy Wei Yan | 2025-07-15 |
| 12362268 | Package assembly including package substrate with elongated solder resist opening and methods for forming the same | Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Zeng | 2025-07-15 |
| 12362299 | Basin-shaped underbump plates and methods of forming the same | Yen-Hao Chen, Han-Hsiang Huang, Chien-Sheng Chen, Shin-Puu Jeng | 2025-07-15 |
| 12362246 | Interposer including stepped surfaces and methods of forming the same | Hsin-Hsien Lee, Jyun-Lin Wu, Yao-Chun Chuang | 2025-07-15 |
| 12344974 | Circular knitting machine with real-time prompt of knitting machine status | Chang-Lin Yang, Po-Wei Huang, Wei-Fan Lai | 2025-07-01 |
| 12347793 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-07-01 |
| 12327772 | Semiconductor package including stress-reduction structures and methods of forming the same | Shu-Shen Yeh, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng, Chin-Hua Wang | 2025-06-10 |
| 12322666 | Package assembly lid and methods for forming the same | Shu-Shen Yeh, Chien-Shen Chen, Po-Yao Lin, Shin-Puu Jeng, Ming-Chih Yew +3 more | 2025-06-03 |
| 12322704 | Package structure with underfill | Shin-Puu Jeng, Po-Yao Lin, Chin-Hua Wang, Shu-Shen Yeh, Che-Chia Yang | 2025-06-03 |
| 12315768 | Package assembly including lid with additional stress mitigating feet and methods of making the same | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Chien-Hung Chen +3 more | 2025-05-27 |
| 12315106 | Frame sequence quality booster using information in an information repository | Yao-Sheng Wang, Pei-Kuei Tsung, Chiani Lu, Chao-Min Chang, Wai Mun Wong | 2025-05-27 |
| 12308346 | Semiconductor die with tapered sidewall in package | Chin-Hua Wang, Shin-Puu Jeng, Po-Yao Lin, Po-Chen Lai, Shu-Shen Yeh +1 more | 2025-05-20 |
| 12272022 | Frame sequence quality booster under uneven quality conditions | Yao-Sheng Wang, Pei-Kuei Tsung, Chiung-Fu Chen, Wai Mun Wong, Chao-Min Chang +2 more | 2025-04-08 |
| 12255119 | Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same | Chin-Hua Wang, Po-Yao Lin, Ming-Chih Yew, Shin-Puu Jeng | 2025-03-18 |
| 12255118 | Package structure and method of fabricating the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2025-03-18 |
| 12234569 | Non-enzyme sensor, non-enzyme sensor element and fabricating method thereof | Hsiang-Yu Wang, Yi-Yu Chen, Shih-Hao Lin | 2025-02-25 |