Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362258 | Thermal module for a semiconductor package and methods of forming the same | Po-Yao Lin, Sheng-Liang Kuo, Yu-Sheng Lin | 2025-07-15 |
KY
Kathy Wei Yan
Overall (2025): #321,398 of 469,880Top 70%
1
Patents 2025