Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362258 | Thermal module for a semiconductor package and methods of forming the same | Po-Yao Lin, Yu-Sheng Lin, Kathy Wei Yan | 2025-07-15 |
| 12300573 | Semiconductor device and manufacturing method thereof | Bo-Jiun Yang, Wen-Sung Hsu, Tai-Yu Chen, Chia-Hao Hsu | 2025-05-13 |