Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362268 | Package assembly including package substrate with elongated solder resist opening and methods for forming the same | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2025-07-15 |