Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354975 | Guard ring structure | Yao-Chun Chuang, Cheng-Chien Li, Ching-Pin Lin | 2025-07-08 |
| 12288735 | Through via structure | Yao-Chun Chuang, Cheng-Chien Li, Ching-Pin Lin | 2025-04-29 |
| 12265119 | Repackaging IC chip for fault identification | Chien-Yi Chen, Kao-Chih Liu, Chia-Hong Lin, Yu-Ting Lin | 2025-04-01 |