Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12265119 | Repackaging IC chip for fault identification | Kao-Chih Liu, Chia-Hong Lin, Yu-Ting Lin, Min-Feng Ku | 2025-04-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12265119 | Repackaging IC chip for fault identification | Kao-Chih Liu, Chia-Hong Lin, Yu-Ting Lin, Min-Feng Ku | 2025-04-01 |