Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368142 | Double side integration semiconductor package and method of forming the same | Monsen Liu, Shuo-Mao Chen, Shin-Puu Jeng | 2025-07-22 |
| 12354940 | Redistribution layer structure with support features and methods | Monsen Liu, Shuo-Mao Chen, Shin-Puu Jeng | 2025-07-08 |
| 12355001 | Semiconductor package structure and method for forming the same | Yen-Chu Tu, Monsen Liu, Shuo-Mao Chen, Shin-Puu Jeng | 2025-07-08 |
| 12272629 | Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materials | Monsen Liu, Shuo-Mao Chen, Po-Ying LAI, Shin-Puu Jeng | 2025-04-08 |