Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431415 | Buffer block structures for C4 bonding and methods of using the same | Ming-Chih Yew, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2025-09-30 |
| 12347764 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Ming-Chih Yew, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-07-01 |
| 12261102 | Semiconductor package and method of forming the same | Ming-Chih Yew, Che-Chia Yang, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-03-25 |