Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394752 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-08-19 |
| 12354867 | Particle removal apparatus | Siao-Chian Huang, Po-Chung Cheng, Ching-Juinn Huang, Tzung-Chi Fu | 2025-07-08 |
| 12283553 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Kuang-Chun Lee, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-04-22 |
| 12191272 | Package structure | Chin-Hua Wang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-01-07 |