Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424511 | High efficiency heat dissipation using discrete thermal interface material films | Shu-Shen Yeh, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2025-09-23 |
| 12315768 | Package assembly including lid with additional stress mitigating feet and methods of making the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng +3 more | 2025-05-27 |
| 12300568 | High efficiency heat dissipation using discrete thermal interface material films | Shu-Shen Yeh, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2025-05-13 |