Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347817 | Semiconductor device package having warpage control | Heh-Chang Huang, Pei-Haw Tsao, Shyue-Ter Leu | 2025-07-01 |
| 12261125 | Method for forming chip package structure | Heh-Chang Huang, Pei-Haw Tsao, Shyue-Ter Leu | 2025-03-25 |