Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417993 | Chip structure | Chien-Cheng Chen | 2025-09-16 |
| 12347817 | Semiconductor device package having warpage control | Heh-Chang Huang, Fu-Jen Li, Shyue-Ter Leu | 2025-07-01 |
| 12261125 | Method for forming chip package structure | Heh-Chang Huang, Fu-Jen Li, Shyue-Ter Leu | 2025-03-25 |
| 12237226 | Dicing method for stacked semiconductor devices | Tsung-Hsing Lu, Jun He, Li-Huan Chu | 2025-02-25 |
| 12230593 | Wafer level package with polymer layer delamination prevention design and method of forming the same | Kai-Heng CHEN, Shyue-Ter Leu, Rung-De Wang, Chien-Chun Wang | 2025-02-18 |
| 12205859 | Package and printed circuit board attachment | Tsung-Hsing Lu, Li-Huan Chu | 2025-01-21 |