Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237226 | Dicing method for stacked semiconductor devices | Jun He, Li-Huan Chu, Pei-Haw Tsao | 2025-02-25 |
| 12205859 | Package and printed circuit board attachment | Pei-Haw Tsao, Li-Huan Chu | 2025-01-21 |