Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230593 | Wafer level package with polymer layer delamination prevention design and method of forming the same | Kai-Heng CHEN, Pei-Haw Tsao, Shyue-Ter Leu, Rung-De Wang | 2025-02-18 |