Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368132 | Joint structure in semiconductor package and manufacturing method thereof | Kuan-Yu Huang, Chih-Wei Wu, Shang-Yun Hou, Ying-Ching Shih, Cheng-Chieh Li | 2025-07-22 |
| 12362196 | Package structure with underfill | Kuan-Yu Huang, Jui Hsieh Lai, Shang-Yun Hou | 2025-07-15 |
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang +8 more | 2025-05-06 |
| 12253729 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Kuan-Yu Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2025-03-18 |
| 12242108 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2025-03-04 |
| 12237288 | Semiconductor die package and method of manufacture | Kuan-Yu Huang, Shang-Yun Hou, Shu-Chia Hsu, Yu-Yun Huang, Wen-Yao Chang +1 more | 2025-02-25 |