Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
CL

Cheng-Chieh Li

TSMC: 1 patents #2,025 of 3,957Top 55%
Overall (2025): #425,419 of 469,880Top 95%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12368132 Joint structure in semiconductor package and manufacturing method thereof Kuan-Yu Huang, Chih-Wei Wu, Sung-Hui Huang, Shang-Yun Hou, Ying-Ching Shih 2025-07-22