Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237288 | Semiconductor die package and method of manufacture | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Shu-Chia Hsu, Yu-Yun Huang +1 more | 2025-02-25 |
WC
Wen-Yao Chang
Overall (2025): #178,111 of 469,880Top 40%
1
Patents 2025