Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
JL

Jui Hsieh Lai

TSMC: 1 patents #2,025 of 3,957Top 55%
Overall (2025): #328,631 of 469,880Top 70%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12362196 Package structure with underfill Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou 2025-07-15