PW

Pu Wang

TSMC: 8 patents #340 of 3,957Top 9%
ME Mitsubishi Electric: 5 patents #7 of 104Top 7%
BU Beihang University: 1 patents #20 of 114Top 20%
Schlumberger Technology: 1 patents #257 of 1,027Top 30%
UC University Of Southern California: 1 patents #21 of 114Top 20%
📍 Hsinchu, MA: #1 of 23 inventorsTop 5%
Overall (2025): #2,292 of 469,880Top 1%
16
Patents 2025

Issued Patents 2025

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
12424587 Semiconductor device having underfill surrounding bottom package and solder ball Jing-Cheng Lin, Ying-Ching Shih, Chen-Hua Yu 2025-09-23
12420800 System and method for tracking an expanded state of a moving object using an online adapted compound measurement model Gang Yao, Karl Berntorp, Hassan Mansour, Petros Boufounos, Philip Orlik 2025-09-23
12412802 Heat dissipation structures for integrated circuit packages and methods of forming the same Chih-Hao Chen, Po-Yuan Cheng, Li-Hui Cheng 2025-09-09
12372609 Frequency modulation continuous wave (FMCW)-based system for estimation and compensation of nonlinearity in linearly swept sources David Millar, Kieran Parsons, Philip Orlik 2025-07-29
12368084 Package structure and manufacturing method thereof Chih-Hao Chen, Po-Yuan Cheng, Li-Hui Cheng, Szu-Wei Lu 2025-07-22
12362245 Package assembly including a package lid having an inner foot and methods of making the same Tsung-Fu Tsai, Ying-Ching Shih, Szu-Wei Lu 2025-07-15
12343110 Multi-modal imaging device Shuhua YUE, Xun Chen 2025-07-01
12339410 Determining shear slowness from dipole source-based measurements acquired by a logging while drilling acoustic measurement tool Sandip Bose, Bikash K. Sinha 2025-06-24
12278162 Coplanar control for film-type thermal interface Yu-Hsun Wang, Ping-Yin Hsieh, Li-Hui Cheng, Szu-Wei Lu 2025-04-15
12266633 Semiconductor structure and method of forming the same Chih-Chien Pan, Li-Hui Cheng, An-Jhih Su, Szu-Wei Lu 2025-04-01
12248054 System and method for detecting an object in a scene Sian Jin, Petros Boufounos, Philip Orlik 2025-03-11
12224224 Package structure with metallic layer over the surfaces of a plurality of semiconductor dies Chih-Hao Chen, Po-Yuan Cheng, Li-Hui Cheng 2025-02-11
12210114 System and method for mutual interference mitigation of FMCW automotive radar Sian Jin 2025-01-28
12213177 Suspendable CSMA/CA for IEEE 802.15.4 system to reduce packet discard caused by backoff failure Jianlin Guo, Yukimasa Nagai, Takenori Sumi, Kieran Parsons, Philip Orlik 2025-01-28
12211818 Manufacturing method of semiconductor package using jig Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu 2025-01-28
12196679 High throughput snapshot spectral encoding device for fluorescence spectral microscopy Francesco Cutrale, Scott E. Fraser 2025-01-14