Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412802 | Heat dissipation structures for integrated circuit packages and methods of forming the same | Chih-Hao Chen, Pu Wang, Li-Hui Cheng | 2025-09-09 |
| 12368084 | Package structure and manufacturing method thereof | Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2025-07-22 |
| 12224224 | Package structure with metallic layer over the surfaces of a plurality of semiconductor dies | Chih-Hao Chen, Pu Wang, Li-Hui Cheng | 2025-02-11 |