Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424448 | Reduction of line wiggling | Jiann-Horng Lin, Cheng-Li Fan | 2025-09-23 |
| 12412802 | Heat dissipation structures for integrated circuit packages and methods of forming the same | Po-Yuan Cheng, Pu Wang, Li-Hui Cheng | 2025-09-09 |
| 12368084 | Package structure and manufacturing method thereof | Po-Yuan Cheng, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2025-07-22 |
| 12347771 | Semiconductor device having fuse array and method of making the same | Meng-Sheng Chang, Shao-Yu Chou, Po-Hsiang Huang, An-Jiao Fu | 2025-07-01 |
| 12300574 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2025-05-13 |
| 12243966 | Light-emitting device | Heng-Ying CHO, Li-Yu SHEN, Keng-Lin CHUANG | 2025-03-04 |
| 12230744 | Light-emitting device with a plurality of concave parts on the edge of the semiconductor mesa | Chao-Hsing Chen, Cheng-Lin LU, Chi-Shiang HSU, I-Lun Ma, Meng-Hsiang HONG +3 more | 2025-02-18 |
| 12224224 | Package structure with metallic layer over the surfaces of a plurality of semiconductor dies | Po-Yuan Cheng, Pu Wang, Li-Hui Cheng | 2025-02-11 |
| 12218282 | Light-emitting device | Aurelien Gauthier-Brun, Chao-Hsing Chen, Chang-Tai HSAIO, Chi-Shiang HSU, Jia-Kuen Wang +1 more | 2025-02-04 |
| 12211818 | Manufacturing method of semiconductor package using jig | Chih-Chien Pan, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2025-01-28 |