Issued Patents 2025
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424515 | SOIC chip architecture | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Hui Yu Lee +1 more | 2025-09-23 |
| 12406877 | Homogeneous source/drain contact structure | Ya-Ching Tseng, Chang-Wen Chen | 2025-09-02 |
| 12382724 | Layout design for header cell in 3D integrated circuits | Cheng-Yu Lin, Pochun Wang, Chih-Liang Chen, Fong-Yuan Chang | 2025-08-05 |
| 12368148 | Info packages including thermal dissipation blocks | Yu-Hao Chen, Fong-Yuan Chang, Ching-Yi Lin, Jyh Chwen Frank Lee | 2025-07-22 |
| 12362235 | Barrier free interface between BEOL interconnects | Hsiu-Wen Hsueh, Chii-Ping Chen, Ya-Ching Tseng | 2025-07-15 |
| 12347771 | Semiconductor device having fuse array and method of making the same | Meng-Sheng Chang, Shao-Yu Chou, An-Jiao Fu, Chih-Hao Chen | 2025-07-01 |
| 12347770 | One-time-programmable device structure | Yu-Hsiang Chen, Wen-Sheh Huang, Hsiu-Wen Hsueh | 2025-07-01 |
| 12341101 | Method for forming a semiconductor structure by diffusing manganese from a seed layer to a barrier layer | Cai-Ling Wu, Hsiu-Wen Hsueh, Chii-Ping Chen, Chi-Feng Lin | 2025-06-24 |
| 12321680 | Integrated circuit fin structure | Fong-Yuan Chang, Clement Hsingjen Wann, Chih-Hsin Ko, Sheng-Hsiung Chen, Li-Chun Tien +1 more | 2025-06-03 |
| 12315862 | Integrated circuit device with improved layout | Fong-Yuan Chang, Chun-Chen Chen, Lee-Chung Lu, Chung-Te Lin, Jerry Chang Jui Kao +2 more | 2025-05-27 |
| 12299369 | Systems and methods of estimating thermal properties of semiconductor devices | Ching-Yi Lin, Fong-Yuan Chang, Po-Yu Chen, Chih-Wei Chang, Jyh Chwen Frank Lee | 2025-05-13 |
| 12293435 | Color change of information elements | Min-Yuan Hsieh, Hsiao-Yu Chiu, Ho-Chih Lin | 2025-05-06 |
| 12277379 | Method and system for generating layout diagram including wiring arrangement | Fong-Yuan Chang, Chin-Chou Liu, Hui-Zhong Zhuang, Meng-Kai Hsu, Pin-Dai Sue +3 more | 2025-04-15 |
| 12261095 | Semiconductor package having an encapulant comprising conductive fillers and method of manufacture | Xinyu BAO, Lee-Chung Lu, Jyh Chwen Frank Lee, Fong-Yuan Chang, Sam Vaziri | 2025-03-25 |
| 12243816 | Semiconductor structure havbing an enhanced E-fuse and a method making the same | An-Jiao Fu, Derek Hsen Dai Hsu, Hsiu-Wen Hsueh, Meng-Sheng Chang | 2025-03-04 |
| 12224482 | Antenna effect protection and electrostatic discharge protection for three-dimensional integrated circuit | Fong-Yuan Chang, Tsui-Ping Wang, Yi-Shin Chu | 2025-02-11 |
| 12223252 | Through-silicon via in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Sen-Bor Jan +2 more | 2025-02-11 |
| 12216981 | System and method for generating layout diagram including wiring arrangement | Fong-Yuan Chang, Chin-Chou Liu, Hui-Zhong Zhuang, Meng-Kai Hsu, Pin-Dai Sue +3 more | 2025-02-04 |