Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12363969 | Passivation layer for epitaxial semiconductor process | Yin-Kai Liao, Sin-Yi Jiang, Hsiang-Lin Chen, Po-Chun Liu, Kuan-Chieh Huang +2 more | 2025-07-15 |
| 12261190 | Vertically stacked light sensors | Hsiang-Lin Chen, Yin-Kai Liao, Sin-Yi Jiang, Sung-Wen Chen | 2025-03-25 |
| 12224482 | Antenna effect protection and electrostatic discharge protection for three-dimensional integrated circuit | Po-Hsiang Huang, Fong-Yuan Chang, Tsui-Ping Wang | 2025-02-11 |
| 12218106 | Backside contact to improve thermal dissipation away from semiconductor devices | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Ping-Tzu Chen +1 more | 2025-02-04 |
| 12205868 | Oversized via as through-substrate-via (TSV) stop layer | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Ping-Tzu Chen | 2025-01-21 |