Issued Patents 2025
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396283 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Pao-Tung Chen, Wen-De Wang, Dun-Nian Yaung | 2025-08-19 |
| 12381195 | Semiconductor devices and methods of manufacture thereof | Shu-Ting Tsai, Dun-Nian Yaung, Szu-Ying Chen, U-Ting Chen | 2025-08-05 |
| 12382744 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Dun-Nian Yaung, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2025-08-05 |
| 12363969 | Passivation layer for epitaxial semiconductor process | Yin-Kai Liao, Sin-Yi Jiang, Hsiang-Lin Chen, Yi-Shin Chu, Po-Chun Liu +2 more | 2025-07-15 |
| 12322694 | Metal-insulator-metal device with improved performance | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Kuan-Hua Lin | 2025-06-03 |
| 12315843 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Min-Feng Kao +3 more | 2025-05-27 |
| 12310137 | Isolation structure to increase image sensor performance | Yen-Ting Chiang, Yen-Yu Chen, Wen-Hao Chang, Tzu-Hsuan Hsu, Feng-Chi Hung +1 more | 2025-05-20 |
| 12283564 | Semiconductor structure and manufacturing method thereof | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Zheng-Xun Li | 2025-04-22 |
| 12278250 | Semiconductor device including image sensor and method of forming the same | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Feng-Chi Hung, Shyh-Fann Ting | 2025-04-15 |
| 12255219 | Image sensor with overlap of backside trench isolation structure and vertical transfer gate | Feng-Chi Hung, Dun-Nian Yaung, Wei Chuang Wu, Yen-Yu Chen, Chih-Kuan Yu | 2025-03-18 |
| 12230554 | Shield structure for backside through substrate vias (TSVs) | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Wei-Tao Tsai | 2025-02-18 |
| 12224298 | Bond pad structure with high via density | Yu-Hsien Li, Yen-Ting Chiang, Shyh-Fann Ting, Dun-Nian Yaung | 2025-02-11 |
| 12218106 | Backside contact to improve thermal dissipation away from semiconductor devices | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Yi-Shin Chu, Ping-Tzu Chen +1 more | 2025-02-04 |
| 12218164 | Semiconductor image-sensing structure and method for forming the same | Ming-Hsien Yang, Wen-I Hsu, KUAN-FU LU, Feng-Chi Hung, Dun-Nian Yaung +2 more | 2025-02-04 |
| 12218165 | Semiconductor image sensor and method of manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Che-Wei Chen | 2025-02-04 |
| 12218166 | CSI with controllable isolation structure and methods of manufacturing and using the same | Min-Feng Kao, Dun-Nian Yaung, Wen-Chang Kuo, Shih-Han Huang | 2025-02-04 |
| 12205868 | Oversized via as through-substrate-via (TSV) stop layer | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Yi-Shin Chu, Ping-Tzu Chen | 2025-01-21 |