Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12310137 | Isolation structure to increase image sensor performance | Yen-Yu Chen, Wen-Hao Chang, Tzu-Hsuan Hsu, Feng-Chi Hung, Shyh-Fann Ting +1 more | 2025-05-20 |
| 12224298 | Bond pad structure with high via density | Yu-Hsien Li, Shyh-Fann Ting, Jen-Cheng Liu, Dun-Nian Yaung | 2025-02-11 |
| 12211876 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze +4 more | 2025-01-28 |