Issued Patents 2025
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432975 | Semiconductor device with backside power rail | Pei-Yu Wang, Yu-Xuan Huang, Huan-Chieh Su, Li-Zhen Yu | 2025-09-30 |
| 12389710 | Full well capacity for image sensor | Kai-Yun Yang, Ching-I Li | 2025-08-12 |
| 12382709 | Semiconductor device structure and method for forming the same | Shih-Chuan Chiu, Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin +1 more | 2025-08-05 |
| 12376356 | Semiconductor devices with backside power rail and methods of fabrication thereof | Pei-Yu Wang, Huan-Chieh Su, Chih-Hao Wang | 2025-07-29 |
| 12363964 | Semiconductor device having dielectric hybrid fin | Huan-Chieh Su, Li-Zhen Yu, Cheng-Chi Chuang, Chih-Hao Wang | 2025-07-15 |
| 12356688 | Method for forming semiconductor device | Sheng-Tsung Wang, Huan-Chieh Su, Lin-Yu Huang, Min-Hsuan Lu, Chih-Hao Wang | 2025-07-08 |
| 12356583 | Heat dissipation module and electronic device | — | 2025-07-08 |
| 12347748 | Semiconductor device and method of manufacturing the same | Yi-Bo Liao, Lin-Yu Huang, Yi-Hsun Chiu, Chih-Hao Wang | 2025-07-01 |
| 12302607 | Backside gate contact | Huan-Chieh Su, Lo-Heng Chang, Li-Zhen Yu, Lin-Yu Huang, Cheng-Chi Chuang +1 more | 2025-05-13 |
| 12278273 | Semiconductor device with backside gate isolation structure and method for forming the same | Huan-Chieh Su, Li-Zhen Yu, Lo-Heng Chang, Cheng-Chi Chuang, Kuan-Lun Cheng +1 more | 2025-04-15 |
| 12272634 | Semiconductor structure having an anchor-shaped backside via | Huan-Chieh Su, Cheng-Chi Chuang, Chih-Hao Wang | 2025-04-08 |
| 12266700 | Semiconductor nanostructures device structure with backside contact | Huan-Chieh Su, Li-Zhen Yu, Shih-Chuan Chiu, Cheng-Chi Chuang, Chih-Hao Wang | 2025-04-01 |
| 12266566 | Contact resistance between via and conductive line | Shih-Chuan Chiu, Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin | 2025-04-01 |
| 12266658 | Semiconductor devices with backside contacts and isolation | Huan-Chieh Su, Cheng-Chi Chuang, Chih-Hao Wang | 2025-04-01 |
| 12261196 | Metal-insulator-metal device capacitance enhancement | Lu-Sheng Chou, Hsuan-Han Tseng, Hsiao-Hui Tseng, Ching-Chun Wang | 2025-03-25 |
| 12243823 | Semiconductor device having backside gate contact | Huan-Chieh Su, Cheng-Chi Chuang, Chih-Hao Wang | 2025-03-04 |
| 12243907 | Multi-layer trench capacitor structure | Hsuan-Han Tseng, Lu-Sheng Chou, Hsiao-Hui Tseng, Ching-Chun Wang | 2025-03-04 |
| 12230572 | Backside signal interconnection | Yu-Xuan Huang, Ching-Wei Tsai, Yi-Hsun Chiu, Yi-Bo Liao, Kuan-Lun Cheng +6 more | 2025-02-18 |
| 12224212 | Semiconductor devices with backside air gap dielectric | Huan-Chieh Su, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang | 2025-02-11 |
| 12211876 | Extra doped region for back-side deep trench isolation | Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2025-01-28 |