Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315843 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2025-05-27 |
| 12300670 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2025-05-13 |
| 12261196 | Metal-insulator-metal device capacitance enhancement | Lu-Sheng Chou, Hsuan-Han Tseng, Chun-Yuan Chen, Hsiao-Hui Tseng | 2025-03-25 |
| 12243907 | Multi-layer trench capacitor structure | Hsuan-Han Tseng, Chun-Yuan Chen, Lu-Sheng Chou, Hsiao-Hui Tseng | 2025-03-04 |
| 12211876 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2025-01-28 |