Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396272 | Stilted pad structure | Sin-Yao Huang, Hung-Ling Shih, Hung-Wen Hsu | 2025-08-19 |
| 12363941 | GAA LDMOS structure for HV operation | Hong-Shyang Wu | 2025-07-15 |
| 12328931 | Hybrid integrated circuit dies and methods of forming the same | Hong-Shyang Wu | 2025-06-10 |
| 12315843 | Hybrid bonding technology for stacking integrated circuits | Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2025-05-27 |
| 12317722 | Color display with color filter layer comprising two-dimensional photonic crystals formed in a dielectric layer | Hong-Shyang Wu | 2025-05-27 |
| 12293946 | Techniques for wafer stack processing | Yung-Lung Lin, Cheng-Hsien Chou, Cheng-Yuan Tsai, Hau-Yi Hsiao | 2025-05-06 |
| 12289905 | Semiconductor structure and associated fabricating method | Jia-Rui Lee, Yi-Chun Lin | 2025-04-29 |
| 12278151 | Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate | Ming-Che Lee, Sheng-Chau Chen, Hau-Yi Hsiao, Guanyu Luo, Ping-Tzu Chen +1 more | 2025-04-15 |
| 12211741 | Multi-wafer capping layer for metal arcing protection | Chih-Hui Huang, Cheng-Hsien Chou, Cheng-Yuan Tsai, Sheng-Chan Li | 2025-01-28 |
| 12205855 | Process tool for analyzing bonded workpiece interface | Hau-Yi Hsiao, Chun-Liang Chen, Sheng-Chau Chen | 2025-01-21 |