Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237165 | Method for wafer bonding including edge trimming | Yung-Lung Lin, Hau-Yi Hsiao, Kuo-Hwa Tzeng, Cheng-Hsien Chou | 2025-02-25 |
| 12211741 | Multi-wafer capping layer for metal arcing protection | Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Sheng-Chan Li | 2025-01-28 |