Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293946 | Techniques for wafer stack processing | Yung-Lung Lin, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu | 2025-05-06 |
| 12278151 | Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate | Ming-Che Lee, Kuo-Ming Wu, Sheng-Chau Chen, Guanyu Luo, Ping-Tzu Chen +1 more | 2025-04-15 |
| 12272715 | High reflectance isolation structure to increase image sensor performance | Sheng-Chan Li, Che-Wei Yang, Sheng-Chau Chen, Cheng-Yuan Tsai | 2025-04-08 |
| 12237165 | Method for wafer bonding including edge trimming | Yung-Lung Lin, Chih-Hui Huang, Kuo-Hwa Tzeng, Cheng-Hsien Chou | 2025-02-25 |
| 12205855 | Process tool for analyzing bonded workpiece interface | Kuo-Ming Wu, Chun-Liang Chen, Sheng-Chau Chen | 2025-01-21 |