Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12360314 | Photonic semiconductor-on-insulator (SOI) substrate and method for forming the photonic SOI substrate | Eugene Chen, Kuan-Liang Liu, De-Yang Chiou, Chia-Shiung Tsai | 2025-07-15 |
| 12315843 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu +3 more | 2025-05-27 |
| 12300670 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2025-05-13 |
| 12293946 | Techniques for wafer stack processing | Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Hau-Yi Hsiao | 2025-05-06 |
| 12237165 | Method for wafer bonding including edge trimming | Hau-Yi Hsiao, Chih-Hui Huang, Kuo-Hwa Tzeng, Cheng-Hsien Chou | 2025-02-25 |