Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322694 | Metal-insulator-metal device with improved performance | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Kuan-Hua Lin | 2025-06-03 |
| 12315843 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Min-Feng Kao +3 more | 2025-05-27 |
| 12300669 | Backside contact for thermal displacement in a multi-wafer stacked integrated circuit | Ping-Tzu Chen, Min-Feng Kao | 2025-05-13 |
| 12283564 | Semiconductor structure and manufacturing method thereof | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Zheng-Xun Li | 2025-04-22 |
| 12278250 | Semiconductor device including image sensor and method of forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shyh-Fann Ting | 2025-04-15 |
| 12230554 | Shield structure for backside through substrate vias (TSVs) | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wei-Tao Tsai | 2025-02-18 |
| 12218106 | Backside contact to improve thermal dissipation away from semiconductor devices | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen +1 more | 2025-02-04 |
| 12218165 | Semiconductor image sensor and method of manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Che-Wei Chen | 2025-02-04 |
| 12205868 | Oversized via as through-substrate-via (TSV) stop layer | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen | 2025-01-21 |