Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424577 | Isolation structure for bond pad structure | Jeng-Shyan Lin, Shih Pei Chou, Tzu-Hsuan Hsu | 2025-09-23 |
| 12400984 | Isolation structure for bond pad structure | Jeng-Shyan Lin, Shih Pei Chou, Tzu-Hsuan Hsu | 2025-08-26 |
| 12396272 | Stilted pad structure | Hung-Ling Shih, Kuo-Ming Wu, Hung-Wen Hsu | 2025-08-19 |
| 12300670 | Hybrid bond pad structure | Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2025-05-13 |