Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424577 | Isolation structure for bond pad structure | Sin-Yao Huang, Shih Pei Chou, Tzu-Hsuan Hsu | 2025-09-23 |
| 12400984 | Isolation structure for bond pad structure | Sin-Yao Huang, Shih Pei Chou, Tzu-Hsuan Hsu | 2025-08-26 |
| 12382744 | Stacked substrate structure with inter-tier interconnection | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2025-08-05 |