Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424577 | Isolation structure for bond pad structure | Sin-Yao Huang, Jeng-Shyan Lin, Tzu-Hsuan Hsu | 2025-09-23 |
| 12419124 | Method for forming light pipe structure with high quantum efficiency | Tsun-Kai Tsao, Jiech-Fun Lu, Tzu-Ming Wang | 2025-09-16 |
| 12400984 | Isolation structure for bond pad structure | Sin-Yao Huang, Jeng-Shyan Lin, Tzu-Hsuan Hsu | 2025-08-26 |
| 12341115 | Bond pad structure with reduced step height and increased electrical isolation | Jiech-Fun Lu | 2025-06-24 |
| 12317613 | Self aligned grids in BSI image sensor | Tsun-Kai Tsao, Jiech-Fun Lu, Wei Chuang Wu | 2025-05-27 |