WW

Wei-Chih Weng

TSMC: 1 patents #2,025 of 3,957Top 55%
📍 Tainan, TW: #286 of 764 inventorsTop 40%
Overall (2025): #176,173 of 469,880Top 40%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12382744 Stacked substrate structure with inter-tier interconnection Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Yu-Yang Shen 2025-08-05