Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12340987 | Tunable plasma exclusion zone in semiconductor fabrication | Che-Wei Yang, Chih-Cheng Shih, Sheng-Chan Li, Cheng-Yuan Tsai | 2025-06-24 |
| 12300670 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2025-05-13 |
| 12302663 | Bond pad structure for bonding improvement | Chin-Wei Liang, Hsun-Chung Kuang, Sheng-Chan Li | 2025-05-13 |
| 12290003 | Conductive structure connection with interconnect structure | Cheng-Tai Hsiao, Cheng-Yuan Tsai, Hsun-Chung Kuang | 2025-04-29 |
| 12278151 | Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate | Ming-Che Lee, Kuo-Ming Wu, Hau-Yi Hsiao, Guanyu Luo, Ping-Tzu Chen +1 more | 2025-04-15 |
| 12272715 | High reflectance isolation structure to increase image sensor performance | Sheng-Chan Li, Hau-Yi Hsiao, Che-Wei Yang, Cheng-Yuan Tsai | 2025-04-08 |
| 12266579 | Method and system for adjusting the gap between a wafer and a top plate in a thin-film deposition process | Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai | 2025-04-01 |
| 12213323 | Embedded backside memory on a field effect transistor | Kuan-Liang Liu, Chung-Liang Cheng, Chia-Shiung Tsai, Yeong-Jyh Lin, Pinyen Lin +1 more | 2025-01-28 |
| 12205855 | Process tool for analyzing bonded workpiece interface | Hau-Yi Hsiao, Kuo-Ming Wu, Chun-Liang Chen | 2025-01-21 |