Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12302663 | Bond pad structure for bonding improvement | Sheng-Chau Chen, Hsun-Chung Kuang, Sheng-Chan Li | 2025-05-13 |
| 12266604 | Techniques to inhibit delamination from flowable gap-fill dielectric | Hsing-Lien Lin, Hsun-Chung Kuang, Ching Ju Yang | 2025-04-01 |