Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327760 | Interconnect structures having varied materials | Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2025-06-10 |
| 12278151 | Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate | Ming-Che Lee, Kuo-Ming Wu, Sheng-Chau Chen, Hau-Yi Hsiao, Ping-Tzu Chen +1 more | 2025-04-15 |