Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237165 | Method for wafer bonding including edge trimming | Yung-Lung Lin, Hau-Yi Hsiao, Chih-Hui Huang, Cheng-Hsien Chou | 2025-02-25 |
| 12211877 | Back-side deep trench isolation structure for image sensor | Cheng-Ta Wu, Yeur-Luen Tu | 2025-01-28 |