Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315843 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu +3 more | 2025-05-27 |
| 12218166 | CSI with controllable isolation structure and methods of manufacturing and using the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo | 2025-02-04 |