Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
CL

Chi-Feng Lin

TSMC: 4 patents #764 of 3,957Top 20%
Overall (2025): #38,437 of 469,880Top 9%
4
Patents 2025

Issued Patents 2025

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
12341101 Method for forming a semiconductor structure by diffusing manganese from a seed layer to a barrier layer Cai-Ling Wu, Hsiu-Wen Hsueh, Chii-Ping Chen, Po-Hsiang Huang 2025-06-24
12334397 Interconnect structure including graphite and method forming same Shu-Cheng Chin, Chih-Yi Chang, Wei Hsiang Chan, Chih-Chien Chi, Hung-Wen Su 2025-06-17
12315764 Conductive structures with barriers and liners of varying thicknesses Shu-Cheng Chin, Chih-Chien Chi 2025-05-27
12237261 Semiconductor device having a contact structure Shu-Cheng Chin, Yao-Min Liu, Hung-Wen Su, Chih-Chien Chi 2025-02-25