Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362261 | Semiconductor device and method of manufacture | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2025-07-15 |
| 12223250 | Method of manufacturing integrated circuit having through-substrate via | Chih-Chia Hu, Ming-Fa Chen, Meng-Wei Chiang | 2025-02-11 |
| 12223252 | Through-silicon via in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Po-Hsiang Huang +2 more | 2025-02-11 |
| 12218093 | Semiconductor die connection system and method | Ming-Fa Chen, Chen-Hua Yu | 2025-02-04 |