Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12223250 | Method of manufacturing integrated circuit having through-substrate via | Chih-Chia Hu, Ming-Fa Chen, Sen-Bor Jan | 2025-02-11 |
MC
Meng-Wei Chiang
Overall (2025): #284,520 of 469,880Top 65%
1
Patents 2025