Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362261 | Semiconductor device and method of manufacture | Sen-Bor Jan, Hsien-Wei Chen, Ming-Fa Chen | 2025-07-15 |
| 12300639 | Seamless bonding layers in semiconductor packages and methods of forming the same | Ming-Fa Chen | 2025-05-13 |
| 12293985 | Integrated circuit packages and methods of forming the same | Ming-Fa Chen, Sung-Feng Yeh | 2025-05-06 |
| 12223250 | Method of manufacturing integrated circuit having through-substrate via | Ming-Fa Chen, Sen-Bor Jan, Meng-Wei Chiang | 2025-02-11 |