Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424515 | SOIC chip architecture | Fong-Yuan Chang, Chin-Chou Liu, Cheng-Hung Yeh, Hui Yu Lee, Po-Hsiang Huang +1 more | 2025-09-23 |
| 12223252 | Through-silicon via in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Cheng-Hung Yeh, Po-Hsiang Huang, Sen-Bor Jan +2 more | 2025-02-11 |